The rise in computing power and energy consumption in data centers has driven the internal structure of servers towards higher power density and more efficient heat dissipation, while also posing new challenges to cooling system design. To meet the higher demands of compact architectures for cooling components, BLT has optimized and designed three low-energy-consumption pure copper cold plates using a flow and heat transfer topology optimization method. With the primary goal of reducing flow resistance while maintaining heat exchange efficiency, these cold plates are tailored to different heat source layouts and operating conditions.
Rendered image of the topology-optimized pure copper cold plates
In liquid cooling systems, the positions of the inlet and outlet for cooling medium are often constrained by the distribution of heat sources and internal piping routes. Thanks to optimized flow channels, the cold plates offer greater design freedom. The inlet and outlet positions can be flexibly adjusted according to actual heat source layouts and piping routes, enabling compatibility with diverse assembly environments and opening up more possibilities for cooling modes.
Rendered image of the topology-optimized pure copper cold plate 1 and 2
The flow channels adopt a three-dimensional design. Leveraging the outer-layer channel features, the cooling medium achieves a “one-to-four” split of the inlet flow. This means a quarter of the flow enters the inner-layer topology flow channels through four separate connecting ports inside the cold plate, converges in the middle, and then flows out. In the inner layer, feature-based optimization ensures that the entire flow channel maintains low flow resistance while guaranteeing heat exchange performance. This helps reduce surface temperature differences across the cold plate and improves temperature uniformity. Additionally, based on engineering experience, BLT’s design team has refined various details of the core, enhancing overall heat exchange efficiency while ensuring good process adaptability for the components.
Rendered image of the topology-optimized pure copper cold plate 3
This series of cold plates is manufactured in one piece using BLT-S200, ensuring dimensional consistency, surface smoothness, and structural integrity, laying a solid foundation for efficient and stable heat dissipation. Through long-term R&D and production practice in cold plate cooling scenarios, BLT has developed mature solutions for the integrated forming and internal quality assurance of pure copper materials, supporting the design and manufacturing of cold plates with various structural features.
BLT’s innovative exhibits for the liquid cooling field will be on display at Booth 7F15 at TCT Asia 2026. Industry peers are welcome to visit and exchange ideas.
